25Gb/s Error-free transmission with a packaged chipset integrating a III-V/SOI DFB laser an electro-absorption modulator and a semiconductor optical amplifier
23 August 2017
We report on the first hybrid III-V on silicon integration of a DFB laser, an electro-absorption modulator and a semiconductor optical amplifier. We packaged the fabricated chipset and validated the module through 25Gb/s error-free transmissions for short reach communication applications.