New telecommunications equipment based on the Integrated Services Digital Network (ISDN) standards is allowing the introduction of many advanced subscriber features.
This paper will focus on RTP application for metallization annealing.
Substantial progress has been made in the receiver signal processing algorithms for wireless communications to minimize the requirements on signal to noise (and/or interference) power ratio and com
The worldwide mobile traffic is growing rapidly and more than 90% of the internet traffic relies on the Transmission Control Protocol (TCP) protocol, which is known to have a poor performance over
VLSI integrated circuits like complex ASICs and SOCs often require a multi clock design style for functional and/or performance reasons.
This paper investigates the combination of spatial multiplexing and overloading as an evolution of the UMTS-HSDPA (High Speed Downlink Packet Access) toward very high spectral efficiencies in the c
AT&T is developing an advanced packaging technology known as Advanced VLSI Packaging (AVP).
This article presents enhancements that further improve the performance of 5G New Radio time division duplex (TDD) operation and performance.
The electro-absorption modulated 1.55microns DFB laser (EML) represents the first III-V optoelectronic integrated circuit in high volume production.
Planar silica device technology provides the ability to filter, route, switch, and attenuate optical signals for Wavelength Division Multiplexing (WDM) based photonic networks.
