A 16-Element W-Band Phased Array Transceiver Chipset with Flip-Chip PCB Integrated Antennas for Multi-Gigabit Data Links
30 November 2015
This paper describes the design and implementation of a W-band phased array system with integrated PCB antennas capable of multi-gigabit spectrallyefficient wireless communication. The chipset is manufactured in a 0.18um SiGe BiCMOS technology with fT/fMAX of 240/270GHz and is flip-chipped onto an organic PCB with integrated antenna arrays. Each chip is equipped with 16-transmit/4-receive or 16-receive/4-transmit calibrated phase shifter elements, direct up- and down-converters plus a half-rate phase locked loop. Each chip operates from 1.5V and 2.5V supplies and consumes xW and xW in transmit and receive mode respectively. The transmitter EIRP is 34dBm in each polarization. A 4.8Gb/s QPSK wireless link in each polarization is demonstrated at a distance of 20-meters.
