A Confocal Laser Package for Undersea Systems: Design Update and Recent Performance Results.
12 January 1987
A report of the confocal laser package development is presented. It has been designed to accept the AT&T 1.5micron laser chip and employs laser welding as an attachment process where high reliability is required. The package design and assembly processes are discussed in detail. Performance data are presented. A detailed report of the prequalification program and its results will supplement this report.