Adhesively bonded assemblies with identical nondeformable adherends: modeling of the induced thermal stresses in the adhesive layer
01 January 1999
A thermoelastic problem for adhesively bonded assemblies with identical nondeformable adherends is considered. The objective of the analysis is to develop a simple stress model for the evaluation of thermally induced stresses and strains in the adhesive material due to its thermal expansion (contraction) mismatch with the material of the adherends. The model is based on the strength-of-materials approach. The cases of an elongated (rectangular) and a circular assembly are examined. The obtained results can be helpful in the stress/strain analysis and physical (mechanical) design of assemblies of the type in question.