Advanced packaging for VLSI.

Systematic improvements in integrated circuit package technology have been required over the past 25 years to meet the increasing needs for device IOs, signal bandwidth and heat dissipation. Until recently, industry standards have allowed package technology development to evolve separately from the companion technologies that are required to design and assemble an electronic system. These standards are breaking down with the emergence of very large scale integration devices, and the result is an increasing variety of package designs and competing technologies.