An Overview of Laminate Materials with Enhanced Dielectric Properties

This report focuses on laminate materials (resins and reinforcements) that have potential applications in the manufacture of multi-layer, high-speed digital printed wiring boards (PWBs). It is intended to be a primer and a reference for selection of candidate materials for high-speed PWBs. Included are dielectric and physical properties, and where available chemical composition and/or structure, commercial availability, compatibility with typical PWB processing schemes and approximate relative cost.