Analysis of interfacial thermal stresses in a trimaterial assembly
07 April 2001
The interfacial stresses in, and the curvature of, an elongated trimaterial assembly, subjected to the change in temperature, are predicted based on an approximate structural analysis (strength-of-materials) model. The obtained results can be helpful in stress-strain evaluations and physical design of trimaterial assemblies in microelectronic and photonic packaging. (C) 2001 American Institute of Physics.