Analytical-Based Solutions for SCALPEL Wafer-Heating

When operating in high-throughput conditions, SCALPEL's 100 KeV electron beam causes significant dynamic wafer deformation. To complement extensive FEA analysis, we have undertaken a rigorous analytical solution to the governing heat transfer and elastic strain equations and boundary conditions. 

This highly efficient, Green's function based computational approach is uniquely able to support a robust and versatile image placement correction strategy.