Attachment reliability of surface mount leaded devices: Predictive modeling through accelerated thermal cycling.
01 January 1987
Long-term solder attachment reliability for Surface Mount (SM) components is established through accelerated thermal cycling of test vehicles. An extrapolation equation for leaded SM devices has been developed which relates solder joint fatigue life data from accelerated environmental cycling to attachment reliability under field service conditions. The interconnection reliability in leaded SM devices is controlled by the lead compliance and bulk solder thermoviscoelastic behavior. Finite element modeling has been applied to characterize the device lead and solder joint mechanical interaction as a function of the temperature-frequency dependent solder modulus. A measure of the composite lead and solder compliance is incorporated into the derived extrapolation model.