Broadband dual-via architectures for multilayer PCB signal injection and intra-layer transition
12 June 2005
In this paper two transmission line architectures for intra-layer transitions in multilayer printed circuit boards (PCBs) are presented. Based on a balanced power divider and combiner concept, these can significantly improve the broadband transmission behavior for transmission rates beyond 10GB/s. The electrical performance for state-of-the-art PCBs is reviewed, and compared to the approach by means of simulations and measurements.