Calculated Thermally Induced Stress in Adhesively Bonded and Soldered Assemblies

The magnitude and the distribution of thermally induced stresses in adhesively bonded or soldered assemblies, subjected to uniform heating or cooling, are determined by using analytical methods of Structural Mechanics and Theory-of-Elasticity. The stresses are caused by the thermal expansion mismatch of materials and include normal stresses, acting over the cross-sections of the components themselves and responsible for the strength of the components, and shearing and transverse normal (peeling) stresses, arising in the interface and responsible for the adhesive and the cohesive strength of the attachment material.