Chapter 13: Assembly Techniques and Packaging of VLSI Devices

The packaging of the VLSI die is a broad subject that ranges from pre-assembly wafer preparation to fabrication technologies for the packages that provides the electrical connection, and mechanical and environmental protection. Cost and/or performance considerations of the packaged device usually dictates the assembly and packaging details. Packaging significantly affects, and in many instances dominates, the overall cost, performance, and reliability of the packaged die. Appropriately, packaging is now receiving more attention by both packaged-device vendors and system builders.