Chapter 6: Dielectric and Polysilicon Film Deposition

Deposited films are widely used in the fabrication of modern VLSI circuits. These films provide conducting regions within the device, electrical insulation between metals, and protection from the environment. Deposited films must meet many requirements. The film thickness must be uniform and reproducible over each device and over all the wafers processed at one time. The structure and composition of the film must be controlled and reproducible. Finally, the method for depositing the film must be safe, reproducible, easily automated, and inexpensive.