Infinite Capacity Engine – Data Center (ICE-D)

Leveraging the unique capabilities of its U.S.-based optical semiconductor fab, Nokia's ICE-D intra-data center optical connectivity technology provides a highly integrated solution that combines multiple optical functions onto a single monolithic chip, resulting in industry-leading density, low latency, and power efficiency. Capable of supporting connectivity speeds of 3.2 Tb/s+ while driving down power per bit by as much as 75 percent, ICE-D technology can enable data center operators to efficiently manage the exponential capacity growth in intra-data center connectivity requirements driven by AI applications.

Unique indium phosphide technology

Based on monolithic indium phosphide (InP) photonic integrated circuit (PIC) technology, ICE-D integrates a variety of optical functions, including distributed-feedback (DFB) lasers, multi-channel arrays, ultra-low voltage Mach-Zehnder modulators (MZMs), low-switching-voltage electro-absorption modulators (EAMs), and photodiode arrays, into a non-hermetic and uncooled single-chip solution enabling high-speed transmission with extremely low power requirements and simplified integration into optical connectivity solutions.

Applications

ICE-D technology supports simplified integration into a variety of different intra- and campus data center optical solutions, including digital signal processor (DSP)-based retimed optics, linear-drive pluggable optics (LPO) and co-packaged optics (CPO) solutions for both serial and parallel fiber applications and distances ranging from 100 meters up to 10 kilometers. Nokia’s solution can be integrated into both electrically switched and optically switched solutions and is designed to fit in industry-standard QSFP and OSFP transceiver formats.

At Nokia's optical semiconductor fab located in Sunnyvale, California, our engineers develop and manufacture industry-leading InP-based PICs for use in high-capacity optical networking solutions. InP is a compound semiconductor material ideal for optical functions that cannot be addressed by silicon. Nokia's revolutionary PICs integrate tuneable lasers, optical amplifiers, high-speed modulators and detectors, and other functions onto a single chip to deliver leading-edge coherent optical transceivers.

Benefits and features

Increased scalability

Capable of speeds up to 3.2 Tb/s, ICE-D provides the scalable connectivity to support the massive intra-DC optical interconnection requirements of even the most advanced AI applications.

Significant power reduction

With unique capabilities enabled by a monolithic InP-based PIC, ICE-D can reduce intra-data center connectivity power requirements by as much as 75%.

Packaging flexibility

ICE-D can be easily packaged in industry-standard transceiver formats for a number of different intra-data center applications, including LPO, LRO and fully retimed solutions, providing a flexible, scalable and low-powered solution.