Here is the abstract of the paper. Give core idea and interest
The evolution of digital transmission systems towards synchronous high speed interconnection among several network nodes requires a new strategy for interoffice transport.
Plate molds are used by AT&T Microelectronics for production plastic packaging of integrated circuit devices.
July-August 1975 Telephone and Telegraph Company. Printed in Number 6 U.S.A. A Molded-Plastic Technique for Connecting and Splicing Optical-Fiber Tapes and Cables By P. W. SMITH, D. L. BISBEE, D.
Correlation among particles in finite quantum systems leads to complex behaviour and novel states of matter.
This paper describes a novel single-chip design of a clock recovery and data retiming circuit.
This circuit has been manufactured in a 0.9micron digital CMOS technology and will recover a clock from NRZ random data.
A fast charge-to-amplitude converter (QAC) chip has been developed for the readout electronics of the electromagnetic calorimeter (ECAL) of the COMPASS experiment at CERN SPS.
A fully integrated push-push voltage controlled oscillator (VCO) with simultaneous differential fundamental output is realized using an advanced 0.13mum SiGe HBT process.
A fully integrated single-ended output push-push oscillator is realized using an advanced 0.2 /spl mu/m SiGe HBT process.
